Heat sinks for integrated circuit modules

Heat exchange – With retainer for removable article – Electrical component

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Details

357 81, 357 79, 165185, H01L 2302

Patent

active

045522065

ABSTRACT:
In dissipating heat from miniature electronic devices, circuit modules, or the like, and particularly from dual-in-line package (DIP) type units having leads depending from opposite sides of a thin molded rectangular-parallelepiped body, an elongated sheet-metal strip of heat-radiating elements disposed above and in spaced relation to the top of the package has its opposite ends integrally connected with separate spaced heat-conducting clip members which are cantilevered from it in different directions to fit respectively about the top and bottom surfaces of the package and to flex so as to accommodate insertion of the package between them and yet adjust themselves into desirable broad-area abutments with those surfaces. Heat conducted away from the package by each of the cantilevered members first reaches a different end of the strip of heat-radiating elements, without coursing through the other member and without interfering with the heat-exchange taking place along the opposite surfaces of the package clipped between the members.

REFERENCES:
patent: 3548927 (1970-12-01), Spurling
patent: 4222090 (1980-09-01), Jafte
patent: 4235285 (1980-11-01), Johnson et al.
patent: 4408220 (1983-10-01), Calabro

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