Heat sinks for integrated circuit modules

Heat exchange – With retainer for removable article – Including liquid heat exchange medium

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Details

357 81, 357 79, H01L 2302, H01L 2348

Patent

active

045081638

ABSTRACT:
In dissipating heat from miniature electronic devices, circuit modules, or the like, and particularly from dual-in-line package (DIP) type units having leads depending from opposite sides of a thin molded rectangular-parallelpiped body, an elongated sheet-metal strip of heat-radiating elements disposed above and in spaced relation to the top of the package has its opposite ends integrally connected with separate spaced heat-conducting clip members are cantilevered from it in different directions to fit respectively about the top and bottom surfaces of the package and to flex so as to accomodate insertion of the package between them and yet adjust themselves into abutments with those surfaces. Heat conducted away from the package by each of the cantilevered members first reaches a different end of the strip of heat-radiating elements, without interfering with the heat-exchange taking place along the opposite surfaces of the package clipped between the members. The two clip members are of configurations exhibiting different stiffness, and are cantilevered from the heat-radiating strip by way of different-length connections, such that these members, once spread widely apart, tend not to maintain the parallelism needed to insure optimum abutments and heat-transfers from a package which has been forcibly wedged between them; that difficulty is corrected by indented stiffening ribbing in the longer cantilevered connection, and that same ribbing is employed to establish a mechanical spacing and thermal isolation from the inner end of an inserted package.

REFERENCES:
patent: 2450203 (1948-09-01), Morgan
patent: 2454357 (1948-11-01), Tolan
patent: 3548927 (1970-12-01), Spurling
patent: 4235285 (1980-11-01), Johnson et al.
patent: 4408220 (1983-10-01), Calabro

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