Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-09-11
2008-08-05
Chervinsky, Boris L (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S699000, C165S080300, C165S080400
Reexamination Certificate
active
07408778
ABSTRACT:
Heat sinks for dissipating a thermal load are disclosed that include: a heat sink base capable of receiving a thermal load from a thermal source; heat-dissipating fins mounted on the heat sink base, each heat-dissipating fin enclosing a hollowed cavity inside the heat-dissipating fin; and a thermal transport within the hollowed cavity of each heat-dissipating fin, the thermal transport capable of convectively transferring the thermal load along a convective heat path within each heat-dissipating fin. Heat sinks for dissipating a thermal load may also include: a pair of electrodes inside each heat-dissipating fin electrically connected to the thermal transport for generating an electric current through the thermal transport; and a magnet mounted adjacent to the heat-dissipating fins for generating a magnetic field through the thermal transport, the magnetic field passing through the electric current and oriented to induce a force on the thermal transport along the convective heat path.
REFERENCES:
patent: 3654528 (1972-04-01), Barkan
patent: 4366857 (1983-01-01), Mayer
patent: 4579167 (1986-04-01), Kuznetsov
patent: 4635705 (1987-01-01), Kuznetsov
patent: 5462685 (1995-10-01), Raj et al.
patent: 5763951 (1998-06-01), Hamilton et al.
patent: 5841634 (1998-11-01), Visser
patent: 6397931 (2002-06-01), Lin et al.
patent: 6410982 (2002-06-01), Brownell et al.
patent: 6588498 (2003-07-01), Reyzin et al.
patent: 6658861 (2003-12-01), Ghoshal et al.
patent: 6708501 (2004-03-01), Ghoshal et al.
patent: 6719039 (2004-04-01), Calaman et al.
patent: 6785134 (2004-08-01), Maveety et al.
patent: 7031160 (2006-04-01), Tillotson
patent: 7040383 (2006-05-01), Oyamada
patent: 2005/0117300 (2005-06-01), Prasher et al.
patent: 2006/0133039 (2006-06-01), Belady
patent: 2007/0230128 (2007-10-01), Kim et al.
Biggers & Obanian LLP
Chervinsky Boris L
International Business Machines - Corporation
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