Heat sinks for dissipating a thermal load

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S699000, C165S080300, C165S080400

Reexamination Certificate

active

07408778

ABSTRACT:
Heat sinks for dissipating a thermal load are disclosed that include: a heat sink base capable of receiving a thermal load from a thermal source; heat-dissipating fins mounted on the heat sink base, each heat-dissipating fin enclosing a hollowed cavity inside the heat-dissipating fin; and a thermal transport within the hollowed cavity of each heat-dissipating fin, the thermal transport capable of convectively transferring the thermal load along a convective heat path within each heat-dissipating fin. Heat sinks for dissipating a thermal load may also include: a pair of electrodes inside each heat-dissipating fin electrically connected to the thermal transport for generating an electric current through the thermal transport; and a magnet mounted adjacent to the heat-dissipating fins for generating a magnetic field through the thermal transport, the magnetic field passing through the electric current and oriented to induce a force on the thermal transport along the convective heat path.

REFERENCES:
patent: 3654528 (1972-04-01), Barkan
patent: 4366857 (1983-01-01), Mayer
patent: 4579167 (1986-04-01), Kuznetsov
patent: 4635705 (1987-01-01), Kuznetsov
patent: 5462685 (1995-10-01), Raj et al.
patent: 5763951 (1998-06-01), Hamilton et al.
patent: 5841634 (1998-11-01), Visser
patent: 6397931 (2002-06-01), Lin et al.
patent: 6410982 (2002-06-01), Brownell et al.
patent: 6588498 (2003-07-01), Reyzin et al.
patent: 6658861 (2003-12-01), Ghoshal et al.
patent: 6708501 (2004-03-01), Ghoshal et al.
patent: 6719039 (2004-04-01), Calaman et al.
patent: 6785134 (2004-08-01), Maveety et al.
patent: 7031160 (2006-04-01), Tillotson
patent: 7040383 (2006-05-01), Oyamada
patent: 2005/0117300 (2005-06-01), Prasher et al.
patent: 2006/0133039 (2006-06-01), Belady
patent: 2007/0230128 (2007-10-01), Kim et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat sinks for dissipating a thermal load does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat sinks for dissipating a thermal load, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sinks for dissipating a thermal load will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4006885

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.