Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-08-18
1999-03-09
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361695, 361706, 361710, 361712, 165 803, 165 804, 165185, 257706, 257707, 257713, 257718, 174 163, H05K 720
Patent
active
058809333
ABSTRACT:
A heat sinking module cover for use with a potted electronic module assembly is disclosed. An electronic module assembly contains heat generating electrical components. Typically the electrical components are held in relation to a module housing. The module housing, generally, not only provides support but also acts as a heat sink for heat generating electrical components. The electrical components are covered by a potting compound. The potting compound protects the electrical components from dust or any other particles that could affect the function of the electrical component. The present invention discloses a heat sinking module cover with a support portion and a thermal transfer portion. The heat sinking module cover is positioned with respect to the module housing to form a box-like structure. The thermal transfer portion contacts the potting material directly to provide an additional heat sinking means for the electronic module assembly.
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Chupp Bradley S.
Holmes Frank R.
Mach Terry P.
Markow Paul A.
Shock Karl W.
Calcaterra Mark P.
DaimlerChrysler Corporation
Datskovsky Michael
Picard Leo P.
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