Heat-sinking arrangement for circuit elements

Details Heat-sinking arrangement for circuit elements Heat-sinking arrangement for circuit elements

1998-08-06

1999-11-30

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361707, 361708, 361709, 361749, 361750, 361751, 361785, 174252, 174254, 165185, H05K 720

Patent

active

059953705

ABSTRACT:
An effective heat-sinking arrangement is realized for circuit elements used in a portable type information terminal having a small restricted space therein. Wherein, a first substrate has a cavity formed in its insulating layer extending to an earthing layer and filled with a silver paste to form a seat for mounting a CPU that can thus thermally contact with the earthing layer, and a second substrate has a cavity formed in an insulating layer in which cavity a heat-conducting cushion bonded to the top of the CPU is fitted for creating the heat-conductive route between the CPU and the earthing layer of the second substrate.

REFERENCES:
patent: 4811165 (1989-03-01), Currier et al.
patent: 4858071 (1989-08-01), Manabe et al.
patent: 5229916 (1993-07-01), Frankeny et al.
patent: 5428190 (1995-06-01), Stopperan
patent: 5631807 (1997-05-01), Griffin
patent: 5708297 (1998-01-01), Clayton
Nikkei Microdevices, pp. 139-140, Mar. 1997.

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