Heat sink with visible logo

Details Heat sink with visible logo Heat sink with visible logo

2005-03-22

2005-03-22

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

CD13S184000, CD13S179000, C165S185000, C165S080300, C257S722000, C361S703000, C361S715000

Reexamination Certificate

active

06870735

ABSTRACT:
A heat sink is for an element to be cooled has a thermally conductive base and a plurality of thermally conductive pins or fins extending substantially perpendicular from the base, said pins or fins being arranged in a predetermined pattern. The pins at least partially frame thermally conductive projections extending substantially perpendicular from said base which forming a discernable logo having an upper surface and sides for providing plural cooling surfaces. In this instance the 3-D logo performs cooling of the components within a package.

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“OCZ Enahnced Latency PC-3500” from The Tech Zone—The Very Latest in Computer Hardware News and Reviews—www.thetechzone.com, Jan. 30, 2003.

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