Heat sink with parallel flat faces

Details Heat sink with parallel flat faces Heat sink with parallel flat faces

1975-08-04

1977-03-15

James, Andrew J.

Heat exchange

With valve or movable deflector for heat exchange fluid flow

With by-pass of heat exchanger or heat exchanger section

357 72, 165 80, 174 16HS, H01L 2302, H01L 2328, E28F 700, H01B 724

Patent

active

040127699

ABSTRACT:
Disclosed is a unitary heat sink apparatus for dissipating thermal energy generated by semiconductor devices encapsulated in an encapsulation device of the JEDEC TO-202 or Motorola Case 152 device case style. The heat sink is a unitary sheet metal device folded to form two opposed end plates joined by a central barrel portion which acts as a spring to urge the opposed faces of the end plates together. The thermal conductor tab extending from the encapsulation device is held between the opposed faces of the end plates.

REFERENCES:
patent: 3222580 (1965-12-01), Curll
patent: 3548927 (1970-12-01), Spurling
patent: 3572428 (1971-03-01), Monaco
patent: 3670215 (1972-06-01), Wilkens et al.
patent: 3694703 (1972-09-01), Wilens et al.
patent: 3893161 (1975-07-01), Pesak
Wakefield Semiconductor Heat Sinks and Thermal Products Distributor Products Catalog No. 102 Copyright 1970.

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