Heat sink with multiple coolant inlets

Heat exchange – With retainer for removable article – Electrical component

Reexamination Certificate

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Details

C165S139000, C165S908000, C257S714000, C361S699000

Reexamination Certificate

active

11242738

ABSTRACT:
The subject invention provides a heat sink for cooling electronic devices. The heat sink includes an upper chamber and a lower chamber separated by a baffle therebetween. The lower chamber includes a base having a central axis and a plurality of curvilinear fins disposed radially about the central axis of the base. The upper chamber includes a lid defining an inlet and an inlet tube interconnecting the upper chamber and the lower chamber for directing a fluid through the upper chamber and impinging the fluid on the base in the lower chamber. A sidewall extends between the base and the lid and is disposed about the fins. The sidewall includes a peripheral inlet for directing the fluid perpendicular to the central axis and at the fins.

REFERENCES:
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patent: 5604665 (1997-02-01), Chrysler et al.
patent: 5640046 (1997-06-01), Suzuki et al.
patent: 6015008 (2000-01-01), Kogure et al.
patent: 6134108 (2000-10-01), Patel et al.
patent: 6781834 (2004-08-01), Nair et al.
patent: 6796370 (2004-09-01), Doll
patent: 2006/0185829 (2006-08-01), Duan et al.
patent: 2007/0039720 (2007-02-01), Ghosh et al.

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