Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-11-24
2001-07-17
Picard, Leo P. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S707000, C361S710000, C257S707000, C165S080300, C024S295000
Reexamination Certificate
active
06262893
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention is directed to heat sink assemblies. In particular, the present invention is directed to heat sink assemblies configured to provide attachment thereto of electronic components without requiring additional parts. Heretofore, attachment of electronic components with heat sinks has been accomplished in several ways. For example, a J-clip structure has been employed wherein a J-shaped clip is oriented to clampingly engage the electronic component against the heat sink using a tapped screw or a bolt-and-nut fastener to apply clamping force to effect the engagement. Supplying clamping force to engage an electrical component with a heat sink base has also been known to be effected using adhesives or spring clips.
Additional operations and associated extra assembly time required for such prior art engagement arrangements contribute to the cost of producing products employing such structures. Moreover, the additional pieces involved in some attachment arrangements provide opportunities for product failure by such events as parts working loose, and dropped or worked-loose parts falling within products. Such loose parts failures may occur either during assembly or during use to cause short-circuit failure by the product. Other clamping structures, such as those using self-tapping screws, may also be problematic; metal particles created by the tapping operation may cause short circuit failure of a product.
Cost of materials is another negative aspect of previous heat sink mounting arrangements. Additional parts, such as screws, washers, bolts, nuts and clips are additional material costs of products employing such heat sink constructions.
There is a need for a heat sink apparatus that facilitates cost-effective assembly of power components for products using cost-effective materials, fewer assembly steps, and less opportunity for misplaced attachment parts to cause short circuit failure of the product.
SUMMARY OF THE INVENTION
An improved heat sink apparatus for use with an electronic component comprises a base portion and a securing portion. The base portion and the securing portion are of unitary construction. The securing portion is configured to flex about an axis to effect an engaged relation with the base portion at a locus distal from the axis. The base portion and the securing portion cooperate in the engaged relation to substantially fixedly maintain the electronic component in abutting relation with the base portion.
The preferred embodiment of the present invention contemplates a one-time assembly operation. As a consequence of such an intended employment, certain advantageous cost-effective material choices may be made.
The unitary construction for a heat sink apparatus according to the present invention avoids the necessity for additional assembly parts such as screws, nuts, bolts, washers, clips and adhesives. The heat sink apparatus of the present invention also avoids the requirement for such expensive materials as spring steel suitable for repeated flexing action to accommodate repeated installations. In such one-time installation, sufficient clamping force may be applied and maintained by cold rolled steel. Cold rolled steel is significantly less expensive than the spring steel that has been used for clip structures designed to accommodate repeated installations in prior heat sink clamping arrangements.
It is, therefore, an object of the present invention to provide an improved heat sink apparatus that is of unitary construction using cost-effective materials.
It is a further object of the present invention to provide an improved heat sink apparatus that may be assembled with an associated electronic component without requiring additional hardware that may be misplaced and cause short circuit failure of a product.
It is yet a further object of the present invention to provide an improved heat sink apparatus that may be assembled with an associated electronic component without unnecessary assembly steps, such as ancillary process operations like drilling or tapping apertures.
Further objects and features of the present invention will be apparent from the following specification and claims when considered in connection with the accompanying drawings, in which like elements are labeled using like reference numerals in the various figures, illustrating the preferred embodiments of the invention.
REFERENCES:
patent: 2772382 (1956-11-01), Escoffery
patent: 4203488 (1980-05-01), Johnson et al.
patent: 4552206 (1985-11-01), Johnson et al.
patent: 4709302 (1987-11-01), Jordan et al.
patent: 5138524 (1992-08-01), Smithers
patent: 5170012 (1992-12-01), Braconier
patent: 5175668 (1992-12-01), Kendel
patent: 5381041 (1995-01-01), Harmon
patent: 5587608 (1996-12-01), Meng
patent: 5611393 (1997-03-01), Vasconcelos et al.
patent: 5930116 (1999-07-01), Palmer
Datskovsky Michael
Mondul Donald D.
Picard Leo P.
LandOfFree
Heat sink with integral component clip does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat sink with integral component clip, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink with integral component clip will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2447467