Heat sink with integral card guide

Details Heat sink with integral card guide Heat sink with integral card guide

2008-03-11

2008-03-11

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S690000, C361S704000, C361S707000, C361S756000, C361S802000, C165S080300, C257S707000

Reexamination Certificate

active

10651115

ABSTRACT:
A heat sink is configured to support an edge of a circuit card. The heat sink comprises a thermally conductive base, a plurality of thermally conductive heat dissipating fins extending from the base, and one or more recesses at least partially defined by at least one of the fins or by the base. The recesses are configured to support the edge of the circuit card.

REFERENCES:
patent: 3631325 (1971-12-01), Wenz
patent: 3845359 (1974-10-01), Fedele
patent: 4330812 (1982-05-01), Token
patent: 4785379 (1988-11-01), Goodrich
patent: 5019939 (1991-05-01), Reimer
patent: 5815371 (1998-09-01), Jeffries et al.
patent: 5883784 (1999-03-01), Hughes et al.
patent: 5986888 (1999-11-01), Amaro et al.
patent: 6226185 (2001-05-01), Lin
patent: 6278609 (2001-08-01), Suzuki et al.
patent: 6307748 (2001-10-01), Lin et al.
patent: 6362963 (2002-03-01), Lee et al.
patent: 6377463 (2002-04-01), Shah
patent: 6459583 (2002-10-01), Lo
patent: 6680849 (2004-01-01), Atkinson et al.

Affiliated with

Also associated with

Rating

Heat sink with integral card guide does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat sink with integral card guide, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink with integral card guide will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3906755