Heat sink with increased cooling capacity and semiconductor...

Details Heat sink with increased cooling capacity and semiconductor... Heat sink with increased cooling capacity and semiconductor...

2007-01-03

2008-10-07

Flanigan, Allen J (Department: 3744)

Heat exchange

With retainer for removable article

Electrical component

C165S185000, C361S705000

Reexamination Certificate

active

07431072

ABSTRACT:
A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor device directly. A heat spreader is provided on the second surface of the base so that the heat spreader does not contact the semiconductor device directly.

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