Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2004-12-23
2008-08-12
Datskovskiy, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S702000, C361S710000, C165S104330, C257S707000, C257S715000
Reexamination Certificate
active
07411790
ABSTRACT:
A heat sink with a built-in heat pipe for semiconductor package is disclosed. At least a built-in heat pipe is disposed in a cavity of a metal vessel and sealed by a metal cover. The built-in heat pipe has an evaporating portion, a condensing portion, and a bent portion between the evaporating portion and the condensing portion. Thermal interface materials are applied in the cavity such that the evaporating portion is thermally coupled to the metal vessel, and the condensing portion is thermally coupled to the metal cover. The metal vessel has a flat surface opposing to the cavity for attaching to a heating surface of a semiconductor package.
REFERENCES:
patent: 4880052 (1989-11-01), Meyer et al.
patent: 5697428 (1997-12-01), Akachi
patent: 5880524 (1999-03-01), Xie
patent: 6133631 (2000-10-01), Belady
patent: 6237223 (2001-05-01), McCullough
patent: 6321452 (2001-11-01), Lin
patent: 6666260 (2003-12-01), Tantoush
patent: 2005/0022984 (2005-02-01), Rosenfeld et al.
patent: 02001168255 (2001-06-01), None
patent: 501792 (2002-09-01), None
Advanced Semiconductor Engineering Inc.
Datskovskiy Michael
Troxell Law Office PLLC
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