Heat sink with a heat pipe for spreading of heat

Details Heat sink with a heat pipe for spreading of heat Heat sink with a heat pipe for spreading of heat

1999-05-05

2001-02-20

Lazarus, Ira S. (Department: 3743)

Heat exchange

With retainer for removable article

Electrical component

C165S104330, C361S700000

Reexamination Certificate

active

06189601

ABSTRACT:

BACKGROUND OF THE INVENTION
1). Field of the Invention
This invention relates to a heat sink for cooling an electronic device which may include a substrate such as a printed circuit board, and a heat generating component such as a semiconductor package mounted to the substrate. More particularly, this invention relates to such a heat sink which is mounted over such a heat generating component.
2). Discussion of Related Art
An electronic device which is located within a computer may, for example, include a printed circuit board and a semiconductor package mounted to the printed circuit board. The semiconductor package may include a semidconductor die. The semiconductor die may, for example be a processor which generates a substantial amount of heat when operated. Various systems may be used for cooling such a semiconductor package.
For example, a heat sink may be mounted over the semiconductor package. The typical heat sink includes a thermally conductive plate located at the semiconductor package, and a plurality of fins located on the thermally conductive plate on a side thereof opposing the semiconductor package. For optimum heat transfer characteristics of such a heat sink, the fins are usually located as dose as possible to the semiconductor package. The overall volume in which the fins can be located is thereby limited which, in turn, limits the number of fins that can be used and therefore the amount of heat that can be transferred.
SUMMARY OF THE INVENTION
The invention provides a heat sink for cooling and electronic device. The heat sink includes a member, and a heat pipe secured to the member. The member has a first portion, a second portion, and a plurality of fins on the second portion. The heat pipe has a first, evaporator section and a second, condenser section. The first section is located at the first portion so that heat can be transferred thereto from a heat generating component of the electronic device. The second section is located at the second portion so that heat can be transferred therefrom to the second portion.


REFERENCES:
patent: 5381859 (1995-01-01), Minakami et al.
patent: 5508908 (1996-04-01), Kazama et al.
patent: 5699853 (1997-12-01), Goth et al.
patent: 5760333 (1998-06-01), Kitashara et al.
patent: 5964279 (2000-03-01), Mochizuki et al.
patent: 6041850 (2000-03-01), Esser et al.
Thermacore Inc. Brochure, Thermal Cooling Solution For Power Semiconductors, pp. 2-6, Apr. 1998.

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