Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-09-19
1998-07-14
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 803, 176 163, 257707, 257713, 361690, H05K 720
Patent
active
057814112
ABSTRACT:
A heat sink that utilizes a chimney effect to create its own airflow provides heat dissipation without requiring a fan or an air flow passageway between the heat sink and the electronic component. By removing material from each one of a plurality of pipes attached to a base of the heat sink, air flow inlets are formed. Heat is dissipated from the heat sink by drawing air in through the air flow inlets, passing the air over a base heated by conduction and heating the air so that the air rises and exits out through an outlet in each of a plurality of pipes attached to the base. Heat is dissipated because of the pulling in and directing of air flow. Thus, the heat sink utilizes the cooling benefits of the chimney effect when the heat sink is placed directly on an electronic component and no air flow passageway exists below the heat sink.
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Gateway 2000 Inc.
Thompson Gregory D.
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