Heat sink used in interface card

Details Heat sink used in interface card Heat sink used in interface card

2011-08-02

2011-08-02

Pape, Zachary M (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S699000, C361S715000, C361S679520, C361S679470, C165S080400, C165S104330, C174S015200, C257S715000, C257SE23088

Reexamination Certificate

active

07990712

ABSTRACT:
A heat sink used in an interface card includes a supporting base, a first heat-dissipating body and a second heat-dissipating body. The supporting base has a side. The first heat-dissipating body is mounted on the supporting base. The first heat-dissipating body is constituted of a plurality of overlapping heat-dissipating pieces. The heat-dissipating pieces are arranged obliquely with respect to the side. The second heat-dissipating body overlaps on the first heat-dissipating body. The second heat-dissipating body comprises a plurality of heat-dissipating pieces. Via the above arrangement, the heat-dissipating efficiency of the interface card can be increased and the lifetime thereof can be extended.

REFERENCES:
patent: 6671177 (2003-12-01), Han
patent: 7327576 (2008-02-01), Lee et al.
patent: 7369412 (2008-05-01), Peng et al.
patent: 7492596 (2009-02-01), Peng et al.
patent: 7495920 (2009-02-01), Chen et al.
patent: 7755902 (2010-07-01), Peng et al.
patent: 2006/0164808 (2006-07-01), Stefanoski
patent: 2007/0171611 (2007-07-01), Peng et al.
patent: 2009/0194260 (2009-08-01), Liao et al.

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