Heat sink tab for optical sub-assembly

Details Heat sink tab for optical sub-assembly Heat sink tab for optical sub-assembly

2008-04-29

2008-04-29

Mack, Ricky (Department: 2873)

Optical: systems and elements

Lens

With support

C385S092000, C385S094000, C257S718000, C257S675000

Reexamination Certificate

active

11042541

ABSTRACT:
The present invention relates to a heat sinking tab for dissipating heat directly from an optical sub-assembly (OSA) to a transceiver housing, within which the optical sub-assembly is located. The heat sinking tab includes a mounting plate for mounting on the rear end of a transistor outline (TO) can, and a finger for extending into contact or close proximity to the transceiver housing. The mounting plate also provides a stiffening plate for flexible conductors used to connect the OSA leads to a transceiver printed circuit board (PCB).

REFERENCES:
patent: 5280191 (1994-01-01), Chang
patent: 6712528 (2004-03-01), Galeotti et al.
patent: 6916122 (2005-07-01), Branch et al.
patent: 6958907 (2005-10-01), Sato et al.
patent: 7121743 (2006-10-01), Mizue
patent: 2003/0180012 (2003-09-01), Deane et al.
patent: 2005/0007741 (2005-01-01), Ice et al.
patent: 2005/0036746 (2005-02-01), Scheibenreif et al.
patent: 2005/0158052 (2005-07-01), Larson

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