Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-12-21
2001-10-30
Thompson, Gregory (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S080200, C165S185000, C174S016300, C174S034000, C174S034000, C257S719000, C257S689000
Reexamination Certificate
active
06310773
ABSTRACT:
TECHNICAL FIELD OF THE INVENTION
The present invention relates generally to heat dispersement and in particular the present invention relates to removing heat from circuitry.
BACKGROUND OF THE INVENTION
Electronic devices, such as integrated circuits, often generate heat as a result of electric current conducted through the devices. As such, the evolution of integrated circuits that contain more densely populated circuit components results in the generation of an increased amount of heat. This heat is often dissipated through heat sinks. These heat sinks are thermally coupled to the integrated circuit packages and often physically rest upon the packages. As a result of increased heat generation, the size of the heat sinks needs to increase to effectively dissipate the increased heat.
The integrated circuit packages can be relatively fragile. Thus, the weight of the increased heat sinks can create problems. The integrity of the integrated circuits can be jeopardized by the heat sinks. This is particularly applicable when the integrated circuit and heat sink are subjected to vibrations.
In addition to the heat generation, integrated circuitry can be susceptible to electro-magnetic interference (EMI). EMI can lead to operational interruption, or even circuit destruction. This interruption or destruction is a result of radiated signals that reach the integrated circuit. To protect components from EMI, designers typically provide a shield around the sensitive circuit components.
The number of transistors contained in a microprocessor, as well as the processor operating speed, has increased dramatically. Correspondingly, the amount of heat that needs to be dissipated, and the amount of EMI emissions that need to be absorbed have increased. As a result, most of today's microprocessor based computer systems employ either local fans and/or heat sinks to help ensure that the microprocessors will run cool. At the same time, increased attention has been given to the design of system chassis to ensure that adequate levels of EMI emission absorption are met. The trend to increase transistor density and operating speed is expected to continue. It is expected that because of the amount of heat that needs to be dissipated, the precision of bonding between the processor package and a heat sink will reach a point of critical importance. That is, the physical bond between the processor package and the heat sink plays a critical role in heat dissipation.
For the reasons stated above, and for other reasons stated below which will become apparent to those skilled in the art upon reading and understanding the present specification, there is a need in the art for a thermal cooling system that allows for heat dissipation without stressing an integrated circuit during vibrations. A thermal cooling system is also desired that assists in EMI shielding.
SUMMARY OF THE INVENTION
The above mentioned problems and other problems are addressed by the present invention and will be understood by reading and studying the following specification.
In one embodiment, a heat dissipation system comprises a heat sink, a deformable support structure to provide vertical support for the heat sink, and a base support structure to retain the deformable support structure.
In another embodiment, an integrated circuit assembly comprises a substrate, an integrated circuit coupled to the substrate, a heat sink thermally coupled to a top surface of the integrated circuit, a deformable support structure to provide vertical support for the heat sink, and a base support structure coupled to the substrate to support and retain the deformable support structure.
In yet another embodiment, an assembly comprises a processor substrate, an integrated circuit processor package having electrical connections coupled to the processor substrate via an intermediate electrical socket, and a heat sink having a bottom surface that is thermally coupled to a top surface of the integrated circuit processor package. A plurality of deformable support structures are vertically located below the heat sink to provide vertical support for the heat sink, and a plurality of base support structures are vertically located below the plurality of deformable support structures. The plurality of base support structures are coupled to the processor substrate to support and retain the plurality of deformable support structures. A retention mechanism is coupled to the heat sink to provide a downward force on the heat sink. The downward force maintains the thermal coupling between the heat sink and the top surface of the integrated circuit processor package. The downward force further compresses the plurality of deformable support members.
REFERENCES:
patent: 4993482 (1991-02-01), Dolbear et al.
patent: 5654876 (1997-08-01), Sathe et al.
patent: 5870285 (1999-02-01), Kosteva et al.
patent: 5920120 (1999-07-01), Webb et al.
Chandran Biju
Yusuf Imran
Intel Corporation
Schwegman Lundberg Woessner & Kluth P.A.
Thompson Gregory
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