Heat sink system

Details Heat sink system Heat sink system

1999-07-29

2001-12-25

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S015200, C361S700000

Reexamination Certificate

active

06333850

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a heat sink system, and particularly to a heat sink system having a fan.
2. Description of Prior Art
As computer technology continues to advance, central processing units and chipsets in computers have faster operational speeds and larger functional capabilities. Heat produced within a computer enclosure increases greatly due to the increase in the operational speed. It is desirable to dissipate the heat quickly, for example using a heat sink system assembled within the computer enclosure, so that the computer chips operate in their normal temperature range. This will assure the quality of data operation, storage and transfer.
A conventional heat sink system includes a heat sink and a fan mounted on the chip. The heat produced by the chip is first transferred to the heat sink attached to the chip, and is then dissipated by the fan mounted on the heat sink. As chips get faster and produce more heat, the size of the heat sink must be correspondingly increased. However, increasing the size of the heat sink is not in line with the trend toward miniaturization in the computer industry. Furthermore, the surface area of a heat sink is limited by practical consideration in manufacturing technology.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide a heat sink system for dissipating heat away from a heat generating element.
In a preferred embodiment of the present invention, a heat sink system, assembled within a computer enclosure for introducing ambient air though an opening of the computer enclosure to dissipate heat away from a heat generating element, comprises a fan duct, a heat pipe and a fan. The fan duct has a surface coupled to the computer enclosure near the opening. The fan duct defines a first hole in communication with the opening and a second hole substantially within an interior of the computer enclosure. The heat pipe is attached and connected between the heat generating element and the fan duct. The fan is assembled within the first hole of the fan duct.


REFERENCES:
patent: 6043980 (2000-03-01), Katsui
patent: 6111748 (2000-08-01), Bhatia

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