Heat sink structure with flexible heat dissipation pad

Heat exchange – Heat transmitter

Reexamination Certificate

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Details

C165S104330, C165S104210, C361S697000, C361S700000, C361S704000, C257S714000, C174S015200

Reexamination Certificate

active

07086458

ABSTRACT:
A heat sink module includes a heat dissipation pad. The heat dissipation pad is flexible and has a cambered shape, and is pressed to become a flat plate when disposed between the heat sink module and a CPU. The heat dissipation pad restores to its original cumbered shape and lifts the heat sink module away from a CPU when a fixing device that fixes the heat sink module to the CPU is disabled. Therefore, one can easily removes the heat sink module without any additional tools or processes.

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