Heat sink structure with embedded electronic components for...

Details Heat sink structure with embedded electronic components for... Heat sink structure with embedded electronic components for...

2006-05-23

2006-05-23

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C257S706000, C257S712000, C165S080300, C165S185000

Reexamination Certificate

active

07050304

ABSTRACT:
A heat sink structure with embedded electronic components is proposed, wherein a plurality of recessed cavities are formed on a heat sink for embedding the electronic components and receiving at least one semiconductor chip therein. This arrangement enhances electric performance of a semiconductor package with the above heat sink structure and improves heat dissipating efficiency of the semiconductor package.

REFERENCES:
patent: 4933808 (1990-06-01), Horton et al.
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5623394 (1997-04-01), Sherif et al.
patent: 5819402 (1998-10-01), Edwards et al.
patent: 5907474 (1999-05-01), Dolbear
patent: 5982038 (1999-11-01), Toy et al.
patent: 6081037 (2000-06-01), Lee et al.
patent: 6281573 (2001-08-01), Atwood et al.
patent: 6437240 (2002-08-01), Smith

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