Heat sink structure for cooling a substrate and an electronic ap

Details Heat sink structure for cooling a substrate and an electronic ap Heat sink structure for cooling a substrate and an electronic ap

1996-05-17

1999-04-20

Leo, Leonard R.

Heat exchange

With retainer for removable article

Electrical component

165185, 174 163, 257722, 361690, 361703, 361704, F28F 700, H01L 2346

Patent

active

058948821

ABSTRACT:
A heat sink structure of a module substrate includes a plurality of stripe-like bottom regions extending in a longitudinal direction and repeated in a lateral direction with a predetermined pitch, a plurality of stripe-like top regions extending in said longitudinal direction and repeated in the lateral direction with said predetermined pitch, such that the stripe-like bottom regions and the stripe-like top regions are repeated alternately in the lateral direction, wherein the stripe-like top regions and the stripe-like bottom regions have respective lateral edges that are connected with each other by cooling fins.

REFERENCES:
patent: 4620216 (1986-10-01), Horvath
patent: 4926935 (1990-05-01), Haushalter
patent: 5195576 (1993-03-01), Hatada et al.
Author Unknown, "Heat Sink Fabrication Method", IBM TDB, vol. 2, No. 10A, Mar. 1985, pp. 5656-5657.
R.G. Biskeborn et al., "Cooling Fin Structure", IBM Tech. Disc. Bull, vol. 25, No. 2, Jul. 1982, p. 618. JP-A-57 122551 (Sumitomo), Jul. 30, 1982.
IBM Technical Disclosure Bulletin, vol. 26, No. 7A, Dec. 1983, Horvath et al., "Metal Cooling Fins for a Semiconductor Package," pp. 3233-3234.
IBM Technical Disclosure Bulletin, vol. 32, No. 9B, Feb. 1990, "Heat Transfer Structure for Semirigidly Mounted, Solder Ball-Connected, IC Chip," pp. 408-409.

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