Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-08-02
2011-08-02
Vortman, Anatoly (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S718000, C361S719000, C361S720000, C361S679540
Reexamination Certificate
active
07990716
ABSTRACT:
A heat sink structure having an improved heat radiation efficiency is disclosed. The heat sink structure comprises a plate-shaped heat sink having a top surface and a bottom surface, wherein through holes along a planar direction of a board are formed between the top surface and the bottom surface of the heat sink.
REFERENCES:
patent: 6377453 (2002-04-01), Belady
patent: 6421240 (2002-07-01), Patel
patent: 6687126 (2004-02-01), Patel et al.
patent: 6972581 (2005-12-01), Yamashita et al.
patent: 7364684 (2008-04-01), Brandenburg et al.
patent: 7616444 (2009-11-01), Munch et al.
patent: 2002/0159233 (2002-10-01), Patel et al.
patent: 2004/0250992 (2004-12-01), Aoki et al.
patent: 2006/0144566 (2006-07-01), Jensen et al.
patent: 2007/0114656 (2007-05-01), Brandenburg et al.
patent: 2008/0175008 (2008-07-01), Hu et al.
patent: 2009/0027073 (2009-01-01), Nishiura
patent: 03274796 (1991-12-01), None
patent: 10-256444 (1998-09-01), None
patent: 11-251496 (1999-09-01), None
patent: 2001-281295 (2001-10-01), None
patent: 2003-289192 (2003-10-01), None
patent: 2008-199058 (2008-08-01), None
patent: 2008-273476 (2008-11-01), None
patent: 0706216 (2007-04-01), None
English language Abstract and translation of JP 11-251496 A (Sep. 17, 1999).
English language Abstract and translation of JP 10-256444 A (Sep. 25, 1998).
Advantest Corporation
Greenblum & Bernstein P.L.C.
Vortman Anatoly
LandOfFree
Heat sink structure and test head with same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat sink structure and test head with same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink structure and test head with same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2752346