Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-01-28
2001-03-20
Picard, Leo P. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S689000, C361S688000, C361S690000, C361S695000, C361S719000, C361S720000, C174S015100, C174S015200, C174S016100, C174S016300, C165S080300, C165S080400, C312S223200
Reexamination Certificate
active
06205025
ABSTRACT:
BACKGROUND OF THE INVENTION
(a) Field of the Invention
The present invention relates to a heat sink structure in a computer housing, more particularly to a heat sink of a low profile and having good heat dissipation effect.
(b) Description of the Prior Art
Conventional heat sinks are mostly directed to dissipating the heat of the central processing units. The central processing unit is generally provided with a fan as well as cooling fins to ensure that it operates at a relatively low temperature to maintain proper operation of the computer. However, the combination of fan and cooling fans has a considerably high profile, which is not advantageous especially for portable computers. There have been numerous attempts to provide low-profile heat sinks for portable computers, and the problem is yet to be solved. Housings having a better heat dissipation effect are formed from aluminum magnesium alloys, which can dissipate heat quick and prevent electromagnetic interference. However, the overall weight of aluminum magnesium housing is heavy, and the cost is quite uneconomical. Besides, it is not very comfortable to use or convenient to carry a computer with a metal housing.
SUMMARY OF THE INVENTION
A primary object of the present invention is to provide a heat sink structure adapted for use in a computer housing, in which a large-area thin metal plate is mounted in a computer housing to increase heat dissipating efficiency. The plate does not add much weight to the computer housing and does not occupy space. Besides, the plate is easy and inexpensive to manufacture, and can be adapted for use in different models of computer housing to dissipate the heat generated by all the components in the computer housing. Furthermore, the plate can better prevent electromagnetic interference.
According to the present invention, a heat sink structure adapted for use in a computer housing includes a thin plate of metal mounted on an inner side of a light plastic computer housing. A clearance is confined between the plate and the computer housing. The plate is connected to a main board disposed above. A heat sink element of a central processing unit on the main board has at least one heat pipe connected to the plate to dissipate heat in the computer housing via the plate. The computer housing is further provided with a fan to guide hot air out. The plate is formed with air vents to enhance air circulation or is provided with ribs to enhance heat dissipation. The plate is preferably formed from copper or aluminum that has good heat conductivity.
REFERENCES:
patent: 5712762 (1998-01-01), Webb
patent: 5949648 (1999-09-01), Liao
patent: 5969940 (1999-10-01), Sano et al.
patent: 5973920 (1999-10-01), Altic et al.
patent: 6043977 (2000-03-01), Nakajima
patent: 6049455 (2000-04-01), Nakamura et al.
Bacon & Thomas PLLC
Chervinsky Boris L.
Picard Leo P.
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