Heat sink structure

Heat exchange – With retainer for removable article – Electrical component

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S704000, C165S135000

Reexamination Certificate

active

10932094

ABSTRACT:
The present invention provides a heat sink structure, which includes: a housing located on a material with low thermal conductivity; and a heat conductor placed inside the housing. At least one air gap is formed between the heat conductor and the housing to reduce the conductivity from the heat conductor to the housing, and thus increasing the thermal resistance between the heat conductor and the housing. The surface temperature of the bottom of the housing thus could be reduced and averaged, so as to effectively improve the lifespan, the safety and reliability of a device with the heat sink structure.

REFERENCES:
patent: 2544183 (1951-03-01), Rogers et al.
patent: 4871015 (1989-10-01), Foley et al.
patent: 5274193 (1993-12-01), Bailey et al.
patent: 5323295 (1994-06-01), Pines
patent: 5469708 (1995-11-01), Harrison et al.
patent: 5894407 (1999-04-01), Aakalu et al.
patent: 5930116 (1999-07-01), Palmer
patent: 6062300 (2000-05-01), Wang et al.
patent: 6140614 (2000-10-01), Padamsee
patent: 6259798 (2001-07-01), Perkins et al.
patent: 6374912 (2002-04-01), LaGrotta et al.
patent: 6504720 (2003-01-01), Furuya
patent: 6586674 (2003-07-01), Krause et al.
patent: 6940712 (2005-09-01), Chu et al.
patent: 2001/0022219 (2001-09-01), Ikeda et al.
patent: 2002/0029868 (2002-03-01), Katsui
patent: 2004/0109322 (2004-06-01), Desanto et al.
patent: 2005/0011199 (2005-01-01), Grisham et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat sink structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat sink structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink structure will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3786701

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.