Heat exchange – Heat transmitter
Reexamination Certificate
2003-04-30
2004-03-09
Flanigan, Allen (Department: 3743)
Heat exchange
Heat transmitter
C165S080200, C257S720000, C361S704000
Reexamination Certificate
active
06702007
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to a heat sink structure and, more particularly, to a heat sink including a highly conductive thermal conductive block on one surface thereof. The thermal conductive block is firmly attached to the heat sink to enhance the overall heat dissipation of the heat sink structure.
The conventional cooler
6
applied to a CPU is shown in
FIGS. 1 and 2
. The cooler
6
includes an aluminum extrusion, and the aluminum extrusion cooler
6
includes a plurality of fins
61
integrally formed with the aluminum extrusion cooler
6
. A fan
62
is installed over the fins
61
to enhance the heat dissipation effect. In addition, a thermal conductive block
63
is installed at a bottom of the cooler
6
. The thermal conductive block
63
is made of highly thermal conductive material such as copper, and the method for installing the thermal conductive block
63
includes forming a receiving slot
64
recessed from the bottom, followed by attaching the thermal conductive block
63
in the receiving slot
64
. Therefore, the cooler
6
is mounted on the CPU
71
on the printed circuit board
7
by adhering the thermal conductive block
63
on the CPU
71
. The heat generated by the CPU
71
can thus be delivered by the thermal conductive block
63
to the cooler
6
, and then dissipated or absorbed by the fan
62
to achieve the heat dissipation function.
However, while mounting the thermal conductive block
63
to the cooler
6
, the thermal conductive block
63
is typically glued within the receiving slot
64
. As space or gap inevitably exists between the thermal conductive block
63
and the cooler
6
, a poor joint is frequently formed to affect the overall heat dissipation effect.
To resolve the problems caused by the conventional cooler as described above, the Applicant, with many years experience in this field, has developed an improved cooler as follows.
BRIEF SUMMARY OF THE INVENTION
The present invention provides a heat sink structure which includes a thermal conductive block firmly attached thereto to result in an enhanced heat dissipation effect.
The heat sink structure provided by the present invention comprises a receiving slot recessed from a bottom thereof. A thermal conductive block is installed in the receiving slot. At four side walls and a top wall of the thermal conductive block, regularly or irregular shaped uneven surfaces are formed. The thermal conductive block is made of material with high thermal conductive efficiency such as copper. A plurality of conical through holes is formed in the thermal conductive block. While assembling, the heat sink is softened by heating first, and the thermal conductive block is pressed into the receiving slot by surge process. As the uneven surfaces increases the contact area between the thermal conductive block and the receiving slot, the wall of the receiving slot is partially pressed into the conical through holes. In a cooling process, the wall of the receiving slot out of the conical through holes tends to contract into the conical through holes; and thus the connection between the thermal conductive block and the receiving slot is further enhanced.
The present invention is also characterized in that the conical through holes formed on the thermal conductive block also provide the gassing function. When the thermal conductive block is pressed into the receiving slot, air can be expelled from the conical through holes, allowing the thermal conductive block firmly fixed to the heat sink.
REFERENCES:
patent: 5594623 (1997-01-01), Schwegler
patent: 5969949 (1999-10-01), Kim et al.
patent: 6245442 (2001-06-01), Towata et al.
patent: 2-281642 (1990-11-01), None
patent: 11-195738 (1999-07-01), None
patent: 2000-77698 (2000-03-01), None
Chou Chia-Min
Kuo Kuei-Yin
Pan Kuan-Da
Shih Po-Chou
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