Heat sink structure

Details Heat sink structure Heat sink structure

2011-05-24

2011-05-24

Walberg, Teresa J (Department: 3785)

Heat exchange

With retainer for removable article

Electrical component

C165S080200

Reexamination Certificate

active

07946336

ABSTRACT:
A heat sink is used for dissipating thermal energy generated by an electronic component of an electronic device. The heat sink includes a contact base and a fin base. The contact base is attached on the electronic component to transfer thermal energy, and the fin base is pivotally connected to the contact base to transfer thermal energy with the contact base. The fin base has a plurality of fins, and rotates relative to the contact base. A center of gravity of the fin base deviates from a rotation axis. When the electronic device is moved, due to the deviated center of gravity, the fin base rotates to make the fins disturb the air inside the electronic device.

REFERENCES:
patent: 6137683 (2000-10-01), Lee et al.
patent: 6447322 (2002-09-01), Yan et al.
patent: 7753107 (2010-07-01), Zhou et al.
patent: 2005/0074995 (2005-04-01), Kimura et al.
patent: 2005/0248918 (2005-11-01), Lin

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