Heat exchange – With retainer for removable article – Electrical component
Patent
1985-02-07
1987-12-15
Davis, Jr., Albert W.
Heat exchange
With retainer for removable article
Electrical component
165133, 357 82, 361385, F28F 306, H01L 2336
Patent
active
047126094
ABSTRACT:
There is disclosed a novel high heat flux liquid cooled semi-conductor heat sink structure suitable for mounting semi-conductor chips such as IC's, hybrids, lasers, and power semi-conductors, said heat sink being made of metals, such as tungsten or Molybdenum; ceramics such as alumina, Beryllia, aluminum nitride, silicon carbide or variants thereof or other suitable material such as crystalline carbon, said semi-conductor heat sink structure including at least one surface suitable for bonding one or more semi-conductor chips in intimate thermal relationship thereto, and including a heat exchange surface on the interior surface thereof, said structure providing means for enclosing said heat exchange surface in a liquid tight manner and including means for providing a flow of coolant liquid to remove heat from said heat exchange surface by formation of nucleate vapor bubbles on said heat exchange surface, the improvement wherein said heat exchange surface includes: means disposed on said heat exchange surface for forming pressure gradients in said liquid having a component perpendicular to said heat exchange surface without substantially impeding the relative velocity between the anode heat exchange surface and said liquid, said component having a magnitude directly proportional to the square of the relative velocity between said anode heat exchange surface and said liquid, to facilitate removal of said nucleate bubbles.
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Boiling Burnout with Water in Vortex Law, Jambell and Green Chemical Eng. Prog. 54,10, 1958, pp. 68-76, pp. 23-26, J. Holdway, Electri-onics, Jan. 1985.
Davis Jr. Albert W.
Neils Peggy
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