Heat exchange – With retainer for removable article – Electrical component
Patent
1994-09-29
1997-04-01
Rivell, John
Heat exchange
With retainer for removable article
Electrical component
257722, 257719, 361709, F28F 700
Patent
active
056157355
ABSTRACT:
An improved heat sink assembly apparatus and method of attachment that includes a heat sink with extruded fins, an integrated circuit package, a printed circuit board and a clamp. The printed circuit board is manufactured with L-shaped holes that correspond to opposing corners of the integrated circuit package and the distance between two notched feet on the clamp. To assemble, the integrated circuit package is mounted to the printed circuit board, the heat sink is mounted to a top surface of the integrated circuit package, the clamp is mounted between extruded fins on the heat sink, and then the feet of the clamp are locked into the L-shaped holes on the printed circuit board.
REFERENCES:
patent: 3038703 (1962-06-01), Deakin
patent: 4679118 (1987-07-01), Johnson et al.
patent: 4745456 (1988-05-01), Clemens
patent: 5052474 (1991-10-01), Bronnert
patent: 5168926 (1992-12-01), Watson et al.
patent: 5208731 (1993-05-01), Blomquist
patent: 5280409 (1994-01-01), Selna et al.
patent: 5287249 (1994-02-01), Chen
patent: 5307239 (1994-04-01), McCarty et al.
patent: 5323845 (1994-06-01), Kin-Shon
patent: 5357404 (1994-10-01), Bright et al.
patent: 5381305 (1995-01-01), Harmon et al.
patent: 5386338 (1995-01-01), Jordan et al.
patent: 5396402 (1995-03-01), Perugini et al.
patent: 5423375 (1995-06-01), Chiou
patent: 5486981 (1996-01-01), Blomquist
Thermalloy, Inc., "New Heat Sink Spring Clip For Use With AMP* Low Insertion Force PGA Sockets," Apr., 1993, *AMP is a Trademark of AMP Incorporated.
EG&G Wakefield Engineering, "669 Series SpiderClip.TM. Heat Sink And Clip Assembly For Intel 80486DX And 80486DX2.TM. Microprocessors," Bulletin 1204, Sep. 1992, Four pages.
Neisen Stephen P.
Seader Rex
Yoshida Stuart
Atkinson Christopher
Baan Cynthia S.
Hewlett-Packard Co.
Rivell John
LandOfFree
Heat sink spring clamp does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat sink spring clamp, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink spring clamp will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-532753