Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2005-02-08
2005-02-08
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
Reexamination Certificate
active
06852573
ABSTRACT:
There is provided a heat sink sheet which can secure a heat source and a heat sink such as an aluminum cooling fin to each other and is superior in heat sink performance. The heat sink sheet is achieved by adhering a pressure sensitive adhesive layer adhered to the whole or part of a surface of a silicone heat sink layer. It is desirable that the pressure sensitive adhesion layer be made of an acrylic-containing adhesive or an urethane-containing adhesive, and a heat sink filler is advantageously blended with the pressure sensitive adhesive layer.
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Ebihara Fumitaka
Takahashi Masahiko
Tatsuzawa Masao
Coleman W. David
Ladas & Parry LLP
Mochida Corporation
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