Heat sink, semiconductor device, and method of manufacturing...

Details Heat sink, semiconductor device, and method of manufacturing... Heat sink, semiconductor device, and method of manufacturing...

2010-07-19

2011-12-13

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080200, C165S185000, C257S707000, C257S713000, C361S717000, C361S718000, C361S722000

Reexamination Certificate

active

08077466

ABSTRACT:
A heat sink109is configured by a plate component having a combined structure composed of a recess and a projection formed thereon, wherein the recess is formed by allowing a part of the plate component to be set back from the surface level of the residual region, and the projection is formed on one surface of the plate component with the progress of formation of the recess, so as to be built up above the level of the residual region of the one surface.

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