Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1992-08-28
1994-02-08
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 803, 257707, 361704, 361816, 454184, H05K 720
Patent
active
052853500
ABSTRACT:
A heat sink comprising a thin plate made of a heat conducting material, which plate includes a series of small tapered chimneys extending therethrough, the plate being adapted to fit over and parallel to an entire circuit board, thermally connecting with the semiconductors on the board, the chimneys being spaced inbetween the semiconductors and facilitating natural or forced airflow from the area between the plate and the printed circuit board to the area outside by means of the low pressure drop created by their tapering, the heat sink taking very little vertical space in the electronics package including the printed circuit board while providing effective heat dissipation and shielding from electro-magnetic radiation and/or radio frequency interference for the semiconductors on the board.
REFERENCES:
patent: 4327398 (1982-04-01), Chistison
patent: 4393436 (1983-07-01), Sugiura
patent: 4609126 (1986-09-01), Janda
patent: 4914551 (1990-04-01), Anschel
patent: 5105336 (1992-04-01), Jacoby
patent: 5175395 (1992-12-01), Moore
Thermal Coupler, IBM Tech Discl Bull, vol. 21 #2 Jul. 1978, Antonelli et al, p. 749.
Aavid Engineering, Inc.
Tolin Gerald P.
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