Heat sink packaging devices

Special receptacle or package – Holder for a removable electrical component – Bar or tapelike carrier for plural components

Patent

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Details

206725, 206460, B65D 8586

Patent

active

060591161

ABSTRACT:
Heat sinks and electrical components pre-coated with a layer of a material such as thermal grease are disclosed. Contamination and migration of the thermal grease is substantially reduced by covering the coated areas with a release liner that is removed prior to the assembly of the heat sink into a circuit board or other assembly. By providing a pre-coated heat sink, productivity can be enhanced, by increasing accuracy with which the thermal grease is applied, thus eliminating waste and clean up. Methods for pre-coating either a heat sink or the release liner with thermal grease are also disclosed. In preferred embodiments areas of the heat sink can be either fully coated, or portions electively coated, and the coating may be accomplished by a silk screening or pad printing process, which includes using an applicator head. The release liner is preferably provided with a pull-off tab to facilitate the removal of the release liner. The present invention also discloses methods and devices for packaging a heat sink and an electrical component capable of mounting to the heat sink that has a layer of thermal grease disposed on its surface. The present invention also discloses improved methods of installing a heat sink using heat sinks that are pre-coated with thermal grease.

REFERENCES:
patent: 2643964 (1953-06-01), Smith-Johannsen
patent: 2711382 (1955-06-01), Smith-Johannsen
patent: 3301315 (1967-01-01), Webb
patent: 3509429 (1970-04-01), Craig et al.
patent: 3972821 (1976-08-01), Weidenbenner et al.
patent: 4505770 (1985-03-01), Larimore
patent: 4602678 (1986-07-01), Fick
patent: 4966281 (1990-10-01), Kawanishi et al.
patent: 4966282 (1990-10-01), Kawanishi et al.
patent: 5033615 (1991-07-01), Shima et al.
patent: 5064063 (1991-11-01), Manca et al.
patent: 5168926 (1992-12-01), Watson et al.
patent: 5571594 (1996-11-01), Minowa et al.
patent: 5667073 (1997-09-01), Okui
patent: 5747139 (1998-05-01), Schenz
patent: 5765692 (1998-06-01), Schenz
Thermalloy, Inc. catalog, "The Best Thermal Management Solutions from Around the World", Nov., 1996, pp. A2-A7 and D9-D11.
LCC/Disensit.RTM., Dispensit Model 1052, Rod Positive Displacement Dispense Valve, 3 pages.

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