Special receptacle or package – Holder for a removable electrical component – Bar or tapelike carrier for plural components
Patent
1997-06-18
2000-05-09
Sewell, Paul T.
Special receptacle or package
Holder for a removable electrical component
Bar or tapelike carrier for plural components
206725, 206460, B65D 8586
Patent
active
060591161
ABSTRACT:
Heat sinks and electrical components pre-coated with a layer of a material such as thermal grease are disclosed. Contamination and migration of the thermal grease is substantially reduced by covering the coated areas with a release liner that is removed prior to the assembly of the heat sink into a circuit board or other assembly. By providing a pre-coated heat sink, productivity can be enhanced, by increasing accuracy with which the thermal grease is applied, thus eliminating waste and clean up. Methods for pre-coating either a heat sink or the release liner with thermal grease are also disclosed. In preferred embodiments areas of the heat sink can be either fully coated, or portions electively coated, and the coating may be accomplished by a silk screening or pad printing process, which includes using an applicator head. The release liner is preferably provided with a pull-off tab to facilitate the removal of the release liner. The present invention also discloses methods and devices for packaging a heat sink and an electrical component capable of mounting to the heat sink that has a layer of thermal grease disposed on its surface. The present invention also discloses improved methods of installing a heat sink using heat sinks that are pre-coated with thermal grease.
REFERENCES:
patent: 2643964 (1953-06-01), Smith-Johannsen
patent: 2711382 (1955-06-01), Smith-Johannsen
patent: 3301315 (1967-01-01), Webb
patent: 3509429 (1970-04-01), Craig et al.
patent: 3972821 (1976-08-01), Weidenbenner et al.
patent: 4505770 (1985-03-01), Larimore
patent: 4602678 (1986-07-01), Fick
patent: 4966281 (1990-10-01), Kawanishi et al.
patent: 4966282 (1990-10-01), Kawanishi et al.
patent: 5033615 (1991-07-01), Shima et al.
patent: 5064063 (1991-11-01), Manca et al.
patent: 5168926 (1992-12-01), Watson et al.
patent: 5571594 (1996-11-01), Minowa et al.
patent: 5667073 (1997-09-01), Okui
patent: 5747139 (1998-05-01), Schenz
patent: 5765692 (1998-06-01), Schenz
Thermalloy, Inc. catalog, "The Best Thermal Management Solutions from Around the World", Nov., 1996, pp. A2-A7 and D9-D11.
LCC/Disensit.RTM., Dispensit Model 1052, Rod Positive Displacement Dispense Valve, 3 pages.
Hinshaw Howard G.
Smithers Matthew C.
Bui Luan K.
Sewell Paul T.
Thermalloy Inc.
LandOfFree
Heat sink packaging devices does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat sink packaging devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink packaging devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1055894