Heat sink mounting device and mounting method, and server...

Details Heat sink mounting device and mounting method, and server... Heat sink mounting device and mounting method, and server...

2007-03-09

2008-10-28

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S790000, C257S724000

Reexamination Certificate

active

07443687

ABSTRACT:
A heat sink mounting device according to the present invention can secure a mounting space of the heat sink sufficiently, mount a heat sink with large capacity, and use a main board in common even when a dual central processing unit (CPU) is constituted by extension of CPU. A main board has an opening. A CPU is mounted on a main surface of the main board. A sub board is attached on the main surface of the main board to permit the opening to be covered. An extension CPU is mounted on the sub board through the opening from a rear face side of the main board. A first heat sink is mounted in the main surface side of the main board to permit the CPU and the opening to be covered. A second heat sink is mounted in the rear face side of the main board to permit the extension CPU and the opening to be covered.

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patent: 58-105556 (1983-06-01), None

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