Heat sink mounting assembly for surface mount electronic device

Details Heat sink mounting assembly for surface mount electronic device Heat sink mounting assembly for surface mount electronic device

1997-10-23

1999-07-27

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361707, 361709, 361710, 361719, 257717, 257718, 257719, 257726, 257727, 165 802, H05K 720

Patent

active

059301147

ABSTRACT:
A mounting assembly for thermally coupling a heat sink to a surface mounted heat generating electronic device package. The mounting assembly essentially comprises a heat generating device package, a mounting attachment, and a heat sink. The mounting attachment and heat generating device package are surface mounted to a PCB or other substrate in mutual thermal communication with a thermal pad on the substrate. The mounting attachment is adapted to facilitate the effective dissipation of heat from surface mounted heat generating electronic device packages while allowing for the post-manufacture installation and exchange of heat sinks.

REFERENCES:
patent: 4235285 (1980-11-01), Johnson et al.
patent: 4625260 (1986-11-01), Jordan et al.
patent: 5365399 (1994-11-01), Kent et al.

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