Heat sink mounting arrangement for a semiconductor

Details Heat sink mounting arrangement for a semiconductor Heat sink mounting arrangement for a semiconductor

1985-04-29

1987-11-17

Davie, James W.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

174 15R, 174 16HS, 174 17R, 165 801, 165 802, 357 74, 357 79, 361380, 361381, H01L 2302, H01B 734, F28F 700, H02B 110

Patent

active

047077263

ABSTRACT:
An arrangement for mounting a packaged semiconductor with a heat sink includes the heat sink having a channel formed therein with a pair of opposed side walls and utilizes one or more spring beams acting against one side wall of the channel to urge the semiconductor package into good heat transferring relation or engagement with the other side wall. The arrangement is especially suited for use with TO-220 transistor packages and uses an array of spring beam fingers joined by a spine in comb-like fashion to facilitate assembly.

REFERENCES:
patent: 3297916 (1967-01-01), Wright
patent: 3436603 (1969-04-01), Vogt
patent: 3571663 (1971-03-01), Hungate
patent: 3624452 (1971-11-01), Hayward et al.
patent: 3909679 (1975-09-01), Petri
patent: 4004528 (1977-01-01), Adams et al.
patent: 4167031 (1979-09-01), Patel
patent: 4193444 (1980-03-01), Boyd et al.
patent: 4204248 (1980-05-01), Proffit et al.
patent: 4288839 (1981-09-01), Prager et al.
patent: 4369485 (1983-01-01), Bell et al.
patent: 4403102 (1983-09-01), Jordan et al.
patent: 4509839 (1985-04-01), Lavochkin
"New Adhesives Speed Heat Removal" by Dr. E. Frauenglass, Dr. J. Moran and Robert Batson, taken from Circuits Manufacturing, dated Feb. 1984, p. 89 ff.

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