Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-05-09
2006-05-09
Feild, Lynn (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S719000, C257S718000, C257S719000, C174S016300, C165S080300
Reexamination Certificate
active
07042727
ABSTRACT:
In some embodiments, a method includes providing a circuit board having a plurality of holes formed therethrough and mounting a spring to an underside of the circuit board such that the mounted spring has a plurality of holes each of which is aligned with a respective one of the holes in the circuit board. Bosses of the spring are each sandwiched between a respective standoff on a chassis and a respective standoff on a heat sink. Holes in the circuit board at the locus of the standoffs are sized so that the circuit board is not sandwiched between the standoffs. The spring presses the circuit board upwardly to bring an integrated circuit in contact with the heat sink.
REFERENCES:
patent: 6097601 (2000-08-01), Lee
patent: 6239974 (2001-05-01), Tseng
patent: 6404634 (2002-06-01), Mann
patent: 6639804 (2003-10-01), Chen
patent: 2004/0047130 (2004-03-01), Liu
patent: 2005/0111190 (2005-05-01), Wang et al.
Ahuja Sandeep
Shia David
Ulen Neal E.
Buckley Maschoff & Talwalkar LLC
Feild Lynn
Intel Corporation
Pape Zachary
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