Heat sink mounting

Details Heat sink mounting Heat sink mounting

1981-10-23

1983-09-06

Husar, Francis S.

Electricity: conductors and insulators

With fluids or vacuum

With cooling or fluid feeding, circulating or distributing

29840, 165 80B, 174 52H, 357 81, 361388, 361389, 361417, 361427, 411171, H01B 734, H05K 334

Patent

active

044031025

ABSTRACT:
Disclosed are methods and apparatus for attaching a heat sink mounted semiconductor case to a circuit board employing a stud with a flange near one end. The longer shank is threaded and at least the shorter shank or head stud is tin-plated. The stud may be swaged into a mounting hole in the heat sink and the heat sink and semiconductor case pre-assembled. The pre-assembled unit may then be mounted and soldered to the circuit board along with other circuit components.

REFERENCES:
patent: 1988926 (1935-01-01), Thomson
patent: 2001290 (1935-08-01), Thomson
patent: 2896136 (1959-07-01), Hales
patent: 3200296 (1965-08-01), Bruestle
patent: 3219748 (1965-11-01), Miller
patent: 3492908 (1970-02-01), Thurston
patent: 3611046 (1971-10-01), Covert
patent: 3697814 (1972-10-01), Christman et al.
patent: 3699637 (1972-10-01), Rosiek
patent: 3836825 (1974-09-01), Hall et al.
patent: 3908188 (1975-09-01), Kawamoto
patent: 3928907 (1975-12-01), Chisholm
patent: 3934177 (1976-01-01), Horbach
patent: 4007477 (1977-02-01), Goodman
PEM Bulletin K480, Penn Eng'r. & Mfg. Corp. (Copyrighted 1962, 1970, 1971, 1974, 1976 & 1980).

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