Heat sink modules for light and thin electronic equipment

Details Heat sink modules for light and thin electronic equipment Heat sink modules for light and thin electronic equipment

2007-08-28

2007-08-28

Hyeon, Hae Moon (Department: 2839)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S705000

Reexamination Certificate

active

11127994

ABSTRACT:
A heat sink module for light and thin electronic equipment, where the module includes a concave top cover, and a bottom cover having on its top surface several equidistantly spaced heat conducting fins of a certain height separated by gaps. Copper powder may cover the concave side of the top cover, and in the gaps between the fins on the top surface of the bottom to form a heat conductor. The top cover and the bottom cover are fit and brazed together to form a unit, where the gaps between the fins form a plurality of connected heat-circulating chambers that are evacuated of air and completely filled with a working fluid. Also, a method of making a heat sink module for light and thin electronic equipment is described.

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