Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-07-29
2008-07-29
Thompson, Gregory D (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S080300, C165S104330, C165S121000, C257S719000, C361S704000, C361S710000, C361S719000
Reexamination Certificate
active
07405937
ABSTRACT:
A heatsink module for dual heat sources for dissipating heat generated by a first and a second heat-generating element disposed on a circuit board is provided. The heatsink module includes a first heat-conducting plate, a second heat-conducting plate, a fixing member, a heat pipe, and a pressing flat spring. The first and second heat-conducting plates contact the first and second heat-generating elements respectively. The fixing member when fixed to the circuit board presses the second heat-conducting plate against the second heat-generating element. One end of the pressing flat spring is under the traction of the fixing member fixed to the circuit board, and presses the first heat-conducting plate against the first heat-generating element. The fixing member and the first heat-conducting plate then clamp the heat pipe, so as to conduct the heat generated by the first and second heat-generating elements to the heat pipe via the connecting elements.
REFERENCES:
patent: 6366460 (2002-04-01), Stone et al.
patent: 6373700 (2002-04-01), Wang
patent: 6407921 (2002-06-01), Nakamura et al.
patent: 6504720 (2003-01-01), Furuya
patent: 6654245 (2003-11-01), Kawashima et al.
patent: 6708754 (2004-03-01), Wei
patent: 6754077 (2004-06-01), Lo et al.
patent: 6966363 (2005-11-01), Gailus et al.
patent: 7120018 (2006-10-01), Shen et al.
patent: 7133287 (2006-11-01), Campini et al.
patent: 7339787 (2008-03-01), Cheng et al.
patent: 2004/0188080 (2004-09-01), Gailus et al.
patent: 2004/0201958 (2004-10-01), Lev
patent: 2007/0236887 (2007-10-01), Cheng et al.
Ke Huang-Cheng
Wang Feng-Ku
Yang Chih-Kai
Inventec C'orporation
Morris Manning & Martin LLP
Thompson Gregory D
Tingkang Xia, Esq. Tim
LandOfFree
Heat sink module for dual heat sources does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat sink module for dual heat sources, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink module for dual heat sources will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2806180