Heat sink module for dissipating heat from a heat source on...

Details Heat sink module for dissipating heat from a heat source on... Heat sink module for dissipating heat from a heat source on...

2006-04-14

2008-03-04

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S700000, C361S704000, C257S714000, C257S715000, C257S721000, C174S015100, C174S015200, C165S080300, C165S080400, C165S104260

Reexamination Certificate

active

07339787

ABSTRACT:
A heat sink module includes a fan set and a heat sink plate. The fan set is integrated as a whole, reducing manufacture time, and the material of the fan set is plastic, thus reducing the weight as well. Due to the hook design of the fan set and the ear design of the heat sink plate, the number of screws is reduced. Furthermore, the screws pass through the first lug of the heat sink plate and the second lug of the fan set, so that the heat sink plate and the fan set are fixed on the motherboard, and thereby the number of the parts to be fixed by screws is reduced. Heat from the heat source on the motherboard is conducted to the fan set to be dispersed through the heat sink plate extending to the heat source and covering the fan set.

REFERENCES:
patent: 6328097 (2001-12-01), Bookhardt et al.
patent: 6442025 (2002-08-01), Nakamura et al.
patent: 6621698 (2003-09-01), Chang
patent: 6654245 (2003-11-01), Kawashima et al.
patent: 6914782 (2005-07-01), Ku
patent: 7057897 (2006-06-01), Leu
patent: 7140423 (2006-11-01), Chang
patent: 2004/0001316 (2004-01-01), Kamikawa et al.
patent: 2005/0083658 (2005-04-01), Huang

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