Heat sink method of manufacturing the same and device of manufac

Details Heat sink method of manufacturing the same and device of manufac Heat sink method of manufacturing the same and device of manufac

1994-11-04

1995-09-05

Breneman, R. Bruce

Coating processes

Coating remains adhesive or is intended to be made adhesive

165 802, 174 163, B05D 510

Patent

active

054477506

ABSTRACT:
The heat sink is mounted on a semiconductor chip module sealed hermetically with a cap. The heat sink comprises an absorption means for absorbing the heat generated from a semiconductor chip, being inserted into an opening formed in a cap so as to make contact with a semiconductor chip sealed hermetically within a semiconductor chip module; a heat dissipation means exposed outside the cap for dissipating the heat of the semiconductor chip absorbed by the absorption means; and a contact surface disposed between the absorption means and the heat dissipation means and fixed on the upper surface of the cap, and the contact surface at least being coated with an adhesive material. The heat sink mounted on a semiconductor chip module can stably dissipate the heat produced from a semiconductor chip sealed hermetically within the semiconductor chip module.

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