Heat sink mechanism hydraulically propelled into contact with se

Heat exchange – With valve or movable deflector for heat exchange fluid flow – With by-pass of heat exchanger or heat exchanger section

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357 65, 165 80, 165105, 174 16B, H01L 2504, H01L 2348, H01L 2940

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active

040670422

ABSTRACT:
An arrangement including a hydraulic chamber for simultaneously regulating the contact pressure on a plurality of heat sinks associated with planar semiconductor devices to be cooled is described. A corresponding plurality of elongated rods coupled at their outer ends to one surface of each of the heat sinks extend outwardly through aligned holes in a boundary wall of the chamber. A plunger or other suitable device extends into the chamber through a second opening therein to vary the pressure on the compressible medium and thereby to urge the heat sinks against the associated semiconductive elements with a uniform pressure. Facilities are provided for electrically deactivating the semiconductive elements when the pressure within the chamber falls below a predetermined value.

REFERENCES:
patent: 3307087 (1967-02-01), Rogers et al.
patent: 3649738 (1972-03-01), Andersson
patent: 3703668 (1972-11-01), Bylund et al.
patent: 3812404 (1974-05-01), Barkan et al.
patent: 3852803 (1974-12-01), Walmet et al.
patent: 3991396 (1976-11-01), Barkan
patent: 3993123 (1976-11-01), Chu et al.

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