Heat sink, in particular for electronic components

Details Heat sink, in particular for electronic components Heat sink, in particular for electronic components

1998-05-19

1999-11-23

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361707, 361709, 361710, 361719, 257718, 257719, 257727, 165 803, 165185, 174 163, H05K 720

Patent

active

059911514

ABSTRACT:
A heat sink (2) for electronic components (1) comprises: a base portion (3) fitted with device (4) for coupling with a fixed support plane (5) of an apparatus; a plane surface (6), positioned in proximity to the base portion (3), in contact with a corresponding surface (7) of the electronic component (1), and an additional heat dissipation portion (8) comprising a prolongation (9) of the base portion (3) from which extend a plurality of fins (10); an elastically yielding element (11) acts between the heat sink (2) and the electronic component (1) to obtain a stable positioning of the surface (7) of the component itself to the related plane surface (6) of the heat sink (2); a pair of fins (10a, 10b), contiguous to each other, presents a respective inner wall (12, 13), sush walls being opposite one to the other and so shaped as to define a compartment (14) for stably housing a portion (15) of the elastically yielding element (11).

REFERENCES:
patent: 4638404 (1987-01-01), Grossmann et al.
patent: 4707726 (1987-11-01), Tinder
patent: 4891735 (1990-01-01), Mikoljczak
patent: 4961125 (1990-10-01), Jordan et al.
patent: 5040096 (1991-08-01), Churchill et al.
patent: 5068764 (1991-11-01), Bland et al.
patent: 5077638 (1991-12-01), Andersson et al.
patent: 5343362 (1994-08-01), Solberg
patent: 5373099 (1994-12-01), Boitard et al.
patent: 5466970 (1995-11-01), Smithers

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