Heat sink having high efficiency cooling capacity and...

Details Heat sink having high efficiency cooling capacity and... Heat sink having high efficiency cooling capacity and...

2007-05-22

2007-05-22

Flanigan, Allen J. (Department: 3744)

Heat exchange

Heat transmitter

C361S705000, C257S720000

Reexamination Certificate

active

10500464

ABSTRACT:
A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor device directly. A heat spreader is provided on the second surface of the base so that the heat spreader does not contact the semiconductor device directly.

REFERENCES:
patent: 5367193 (1994-11-01), Malladi
patent: 5594623 (1997-01-01), Schwegler
patent: 5658831 (1997-08-01), Layton et al.
patent: 5969949 (1999-10-01), Kim et al.
patent: 5981085 (1999-11-01), Ninomiya et al.
patent: 6114048 (2000-09-01), Jech et al.
patent: 6245442 (2001-06-01), Towata et al.
patent: 6702007 (2004-03-01), Pan et al.
patent: 6847113 (2005-01-01), Nakanishi et al.
patent: 6849941 (2005-02-01), Hill et al.
patent: 6898084 (2005-05-01), Misra
patent: 6977814 (2005-12-01), Hornung
patent: 2002/0179287 (2002-12-01), Graf et al.
patent: 2003/0116312 (2003-06-01), Krassowski et al.
patent: 2004/0223303 (2004-11-01), Hornung
patent: 7-273256 (1995-10-01), None
patent: 9-8188 (1997-01-01), None
patent: 11-317479 (1999-11-01), None

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