Heat sink having enhanced heat dissipation capacity

Details Heat sink having enhanced heat dissipation capacity Heat sink having enhanced heat dissipation capacity

2011-03-29

2011-03-29

Chervinsky, Boris L. (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S709000, C174S521000, C428S076000, C428S698000

Reexamination Certificate

active

07916484

ABSTRACT:
A heat sink includes a metallic heat conducting layer, a non-metallic heatsink layer combined with the metallic heat conducting layer and having a porous structure, and a hollow receiving space defined between the metallic heat conducting layer and the non-metallic heatsink layer. Thus, the heat produced by a heat source is conducted quickly and distributed evenly on the metallic heat conducting layer to form an evenly heat conducting effect, while the hollow receiving space has a heat convection effect to quickly transfer the heat on the metallic heat conducting layer to the non-metallic heatsink layer which produces a heatsink effect to dissipate the heat so that the heat is dissipated quickly by provision of the metallic heat conducting layer, the hollow receiving space and the non-metallic heatsink layer.

REFERENCES:
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patent: 6191944 (2001-02-01), Hammel et al.
patent: 7447029 (2008-11-01), Lai et al.
patent: 2003/0024611 (2003-02-01), Cornie et al.
patent: 2006/0011336 (2006-01-01), Frul

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