Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-11-26
2001-05-01
Thompson, Gregory (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C257S719000, C361S818000, C439S487000
Reexamination Certificate
active
06226185
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a heat sink, and more particularly to a heat sink having an anti-electromagnetic wave device.
2. Description of the Prior Art
Typical heat sinks are provided for dissipating the heat of the electric integrated circuits. The closest prior art of which the applicant is aware is his prior U.S. Pat. No. 5,864,464 to Lin and comprises a heat sink detachably secured to an integrated circuit with one or more fastener blades. The typical heat sinks have no device for anti-electromagnetic wave purposes.
The present invention has arisen to mitigate and/or obviate the afore-described disadvantages of the conventional heat sinks.
SUMMARY OF THE INVENTION
The primary objective of the present invention is to provide a heat sink assembly having an anti-electromagnetic wave device for preventing the integrated circuit from being interrupted by the electromagnetic wave.
In accordance with one aspect of the invention, there is provided a heat sink assembly comprising a printed circuit board, a socket secured on the printed circuit board, an apparatus secured on the socket, a heat sink disposed on the apparatus, a resilient retainer clip engaged with the heat sink and the socket for biasing the heat sink toward the socket, and means for dissipating electromagnetic waves.
The electromagnetic waves dissipating means includes an anti-electromagnetic wave device having a downwardly projecting leg engaged with the printed circuit board and having a head engaged with the resilient retainer clip. The socket includes at least one lug extended laterally therefrom, the resilient retainer clip includes at least one arm downwardly projected therefrom and engaged with the lug of the socket for biasing the heat sink toward the socket, the head of the anti-electromagnetic wave device is engaged with the arm of the resilient retainer clip.
The lug of the socket includes a groove formed therein, the head of the anti-electromagnetic wave device is bent from the anti-electromagnetic wave device and engaged through the groove of the lug of the socket and engaged with the arm of the resilient retainer clip.
A securing device may secure the anti-electromagnetic wave device to the lug of the socket and includes an aperture formed in the lug of the socket, and a latch formed on the anti-electromagnetic wave device and engaging with the aperture of the lug of the socket for securing the anti-electromagnetic wave device to the lug of the socket.
The printed circuit board includes a conductor secured thereto and engaged with the downwardly projecting leg of anti-electromagnetic wave device.
REFERENCES:
patent: 5241453 (1993-08-01), Bright et al.
patent: 5357404 (1994-10-01), Bright et al.
patent: 5771960 (1998-07-01), Lin
patent: 5864464 (1999-01-01), Lin
Asia Vital Components Co. Ltd.
Baxley Charles E.
Thompson Gregory
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