Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-04-08
2008-04-08
Smith, Courtney L (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S707000, C361S724000, C361S816000, C361S818000, C361S689000, C361S699000, C257S712000, C257S718000, C257SE23086, C174S016100, C174S378000, C174S383000, C174S016300, C174S032000, C174S351000, C174S350000, C174S358000, C439S076100, C439S924100, C165S080300, C165S080400
Reexamination Certificate
active
11348647
ABSTRACT:
A receptacle assembly is provided having a gasket interposed between a heat sink and the receptacle, in order to provide EMI shielding and limit leakage from an opening in the receptacle that allows the heat sink to engage an electronic module inserted in the receptacle cavity. The heat sink may have a groove in which the gasket is mounted and upon mounting the heat sink to the receptacle, the gasket surrounds the opening in the receptacle and provides a resilient shield to maintain a seal during movement of the heat sink due to insertion of the electronic module within the receptacle.
REFERENCES:
patent: 4061413 (1977-12-01), Keller
patent: 4678716 (1987-07-01), Tzeng
patent: 4945633 (1990-08-01), Hakanen et al.
patent: 5030793 (1991-07-01), McCarthy
patent: 5187621 (1993-02-01), Tacklind
patent: 5241453 (1993-08-01), Bright et al.
patent: 5252782 (1993-10-01), Cantrell et al.
patent: 5280191 (1994-01-01), Chang
patent: 5311408 (1994-05-01), Ferchau et al.
patent: 5381314 (1995-01-01), Rudy, Jr. et al.
patent: 5412340 (1995-05-01), Tanikoshi
patent: 5416668 (1995-05-01), Benzoni
patent: 5483423 (1996-01-01), Lewis et al.
patent: 5566052 (1996-10-01), Hughes
patent: 5703754 (1997-12-01), Hinze
patent: 5731541 (1998-03-01), Bernd et al.
patent: 5761042 (1998-06-01), Widmayer et al.
patent: 5804875 (1998-09-01), Remsburg et al.
patent: 5880930 (1999-03-01), Wheaton
patent: 5947753 (1999-09-01), Chapman et al.
patent: 5982620 (1999-11-01), Lin
patent: 6023415 (2000-02-01), Mayer et al.
patent: 6058014 (2000-05-01), Choudhury et al.
patent: 6065530 (2000-05-01), Austin et al.
patent: 6116924 (2000-09-01), Laut
patent: 6128194 (2000-10-01), Francis
patent: 6137051 (2000-10-01), Bundza
patent: 6178318 (2001-01-01), Holmberg et al.
patent: 6198630 (2001-03-01), Cromwell
patent: 6201704 (2001-03-01), Poplawski et al.
patent: 6219239 (2001-04-01), Mellberg et al.
patent: 6220873 (2001-04-01), Samela et al.
patent: 6243265 (2001-06-01), Wong et al.
patent: 6330745 (2001-12-01), Cromwell et al.
patent: 6392900 (2002-05-01), Petty et al.
patent: 6445583 (2002-09-01), Kline et al.
patent: 6515861 (2003-02-01), Andric et al.
patent: 6577504 (2003-06-01), Lafland et al.
patent: 6624432 (2003-09-01), Gabower et al.
patent: 6749448 (2004-06-01), Bright et al.
patent: 6752663 (2004-06-01), Bright et al.
patent: 6816376 (2004-11-01), Bright et al.
patent: 6884937 (2005-04-01), Mistry et al.
patent: 6892796 (2005-05-01), Nagashima et al.
patent: 6935882 (2005-08-01), Hanley et al.
patent: 6944025 (2005-09-01), Hockonson et al.
patent: 6980437 (2005-12-01), Bright
patent: 7168971 (2007-01-01), Manson et al.
patent: 2002/0135983 (2002-09-01), Freitas et al.
patent: 2005/0190540 (2005-09-01), Shearman et al.
patent: 2005/0195565 (2005-09-01), Bright
patent: 2006/0012969 (2006-01-01), Bachman
patent: 2006/0279937 (2006-12-01), Manson et al.
Laird Technologies, “Mold-In-Place Printed Circuit Board Shielding”, Elastomeric EMI Sheilding Solutions, Oct. 2002, cover, 42 and back pg.
David A. Case and Michael J. Oliver, Compliance Engineering, “A Method for Evaluating EMI/RFI Gasket Material in PCMCIA Cards”, Nov. 27, 2005, pp. 1-7.
XFP Promoters, “XFP (10 Gigabit Small Form Factor Pluggable Module)”, Revision 3.1, Apr. 2, 2003, pp. i-xv, 1-160.
Llorens Joseph R.
Pirillis Alexandros
Methode Electronics Inc.
Seyfarth Shaw LLP
Smith Courtney L
LandOfFree
Heat sink gasket does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat sink gasket, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink gasket will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3935934