Heat sink for utilization with high density integrated circuit s

Details Heat sink for utilization with high density integrated circuit s Heat sink for utilization with high density integrated circuit s

1989-12-29

1991-04-09

James, Andrew J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 75, 357 81, 361382, 361385, 361386, 165 804, H01L 2504, H01L 2316, H01L 2302, H02B 100

Patent

active

050069241

ABSTRACT:
A heat sink for utilization in thermal management of high density integrated circuit substrates is disclosed. Each heat sink includes at least one compliant bag containing a mass of thermally conductive fluid. Within each compliant bag is an aperture which contains a thin pliable metallic membrane having a high Z axis thermal conductivity. The metallic membrane is adapted to slidably mate with a surface of an integrated circuit device to permit relative motion during thermal mismatch while enhancing thermal conductivity from the integrated circuit device into the thermally conductive fluid. A second metallic membrane is preferably mounted to the upper surface of the compliant bag and is thermally coupled to a plurality of cooling fins. In one embodiment of the present invention, a plurality of such compliant bags are serially interconnected and a pump is utilized to circulate fluid through each compliant bag. In this embodiment, a pair of rigidly mounted needle valves may be utilized to automatically couple the fluid pump to the plurality of compliant bags in response to the electrical connection of a substrate incorporating such a heat sink.

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