Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-04-08
2008-04-08
Datskovskiy, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S717000, C361S719000, C165S080200, C165S080300, C165S104330, C174S016300, C174S252000
Reexamination Certificate
active
11375565
ABSTRACT:
A heat sink for surface-mounted semiconductor devices is provided on a superordinate circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are spring-elastically connected to the press-on region of the heat sink via a spring-elastic connecting region of the heat sink. The snap-action hooks engage with edge regions of a thermally conductive coupling plate with the press-on region generating pressure. The coupling plate is fixed to a rear side of a semiconductor chip of the surface-mounted semiconductor device.
REFERENCES:
patent: 5893409 (1999-04-01), Kohler et al.
patent: 6188576 (2001-02-01), Ali et al.
patent: 6191478 (2001-02-01), Chen
patent: 6208517 (2001-03-01), Prince et al.
patent: 6233150 (2001-05-01), Lin et al.
patent: 6275380 (2001-08-01), Bollesen
patent: 6445583 (2002-09-01), Kline et al.
patent: 7224048 (2007-05-01), McLellan et al.
patent: 7230831 (2007-06-01), Luckner et al.
patent: 24 25 723 (1974-05-01), None
patent: 196 40 381 (1998-06-01), None
patent: 0 777 270 (1997-04-01), None
Gruendler Gerold
Hoegerl Juergen
Killer Thomas
Strutz Volker
Syri Erich
Datskovskiy Michael
Edell Shapiro & Finnan LLC
Infineon - Technologies AG
LandOfFree
Heat sink for surface-mounted semiconductor devices and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat sink for surface-mounted semiconductor devices and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink for surface-mounted semiconductor devices and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3905907