Heat sink for plastic casings

Metal working – Method of mechanical manufacture – Electrical device making

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723792, B21D 5304

Patent

active

057819920

ABSTRACT:
A heat sink for mounting a semiconductor chip in a plastic casing. The upper surface of the heat sink is in thermal contact with the semiconductor chip, the lower surface is coplanar with a main surface of the casing. The heat sink is formed from a substantially square sheet of metal having each of its corners folded as a tongue to provide a substantially square base, each of the folded tongues forming the lower surface of the base.

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